Saad Idrissi

• Optimization of PCB layout: Reduction of diameter from 40 mm to 30 mm with 6 layers and integration with a 4-layer FOC controller board.

• Analysis of current hardware schematics.

• Development of hardware for Ethernet and RS485 communication protocol options with Altium Designer.

• Design of the power supply for the system based on linear regulation and overvoltage protection system (24V).

• Component selection: Parameter calculation and thermal constraint analysis.

• LT Spice simulation.

• Implementation and testing of the linear regulation system.

• Support for the layout designer: Requirements for PCB layout for high-speed signals (Ethernet) / component placement.

• Support for the software team.

• Troubleshooting tests.

• EMC tests according to standards (CISPR32 / 6100-4-4 /6100-4-2).

• Solution proposals for passing EMC tests.

• Manufacturing support (SMT)

• Support with test specification / EOL

• Troubleshooting using measuring instruments such as oscilloscope and logic analyzer

• Data analysis with Excel

Hardware circuit analysis:

• Requirements analysis.

• LT Spice simulation for the sensor based on thermal conductivity.

• Sensor performance test: Signal measurement.

• Characterization of the ripple effect of DC-DC converters.

• Analysis of sensor output data.