DMAbout Damien
Over 26 years Mixed Signal Analog & Digital, Multi-layer, RF Product Develop-
ment and PCB R&D design experience. RF / CELLULAR / Bluetooth / Wi-Fi /
EMC. High Temp Test Methods: (RF)HTOL & bHAST. Altium Designer CAD. DFT
/ DFM, Military Spec, BOM & Gerber X2
English
Native or bilingual
German
Basic
Remote only
Primarily works remotely
Experience
- QualcommLEAD ALTIUM RF PCB DESIGNERTELECOMMUNICATIONSJanuary 2017 - June 2025 (8 years and 5 months)Munich, Germany• Creating Procedures, systems and best work practices for the team to follow• Complex BGA/LGA/0201/High Temp multilayer RF PCB Layout• Track Impedance calculations / SMA/ SMP Connectors• High Temp Military Specification Component evaluation.• Creation of Schematic Symbols / PCB Footprints / 3D Step Models• Creation of secure Access Database Library (.dbLib)• Design of Accelerated Stress Test Platform (bHAST & RFHTOL) PCBs• Drop test PCBs in accordance with the JEDEC STANDARDS• Development of High Temp Mobile Phone Module Test platforms• I2C, RF Power & Temp sensors• GERBERX2 files for PCB Houses, CAM Files etc.
- LM TechnologiesLEAD ALTIUM PCB DESIGN ENGINEERMay 2014 - August 2016 (2 years and 3 months)London, UKLEAD ALTIUM PCB DESIGN ENGINEER designing Wifi and Bluetooth USB and RS232 modules for industrial use
- ETL SystemsALTIUM PCB RF DESIGN ENGINEERJune 2012 - August 2014 (2 years and 2 months)London, UKALTIUM PCB RF DESIGN ENGINEER designing Laying out PCBs for RF splitters for Satellite and military use.
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Education
- MASTER'S DEGREE (MSC.)University of ulster Jordanstown1999MASTER'S DEGREE (MSC.)
- BACHELOR DEGREE (BSC)University of Ulster1998BACHELOR DEGREE (BSC)